Peak temperature, solder & cleaning
Nextep answerPCB, polyimide and laser-markable labels
Electronics, EMS & Semiconductor
Every board, module and cable carries an identity.
Identifiers must stay readable through the manufacturing process and the service life.
Discuss your application →WHERE NEXTEP FITS
Made for what the product has to withstand.
Identification and components for boards, modules, racks and equipment. We start with the application, then align material, construction and process to the performance requirement.
PCB / PCBA manufacturingComponents & modulesMobile & compact devicesPower electronics
FROM CHALLENGE TO SOLUTION
How Nextep responds.
Code readability to service
Nextep answerSerial, product and 2D-code labels
Heat in compact assemblies
Nextep answerThermal interface materials and gap fillers
Electrical separation
Nextep answerFR4, Nomex®, Formex® and polyester films
Critical checks
- High-temperature process exposure
- Code readability through assembly
- Compact geometries and cleanroom needs
Typical Nextep solutions
- PCB & polyimide labels
- Serial and 2D-code labels
- Thermal interface materials
- Electrical insulation films
ENGINEERING, NOT GUESSWORK
From application definition to revision-controlled repeat supply.
Our in-house print, lamination, die-cutting, slitting and inspection processes are coordinated around your specified product.
Explore the portfolio →BEFORE WE QUOTE
Questions we will ask about your Electronics, EMS & Semiconductor application.
Every segment has its own deciding factors. Have these answers ready and we can recommend the right construction faster.
Answer these in an enquiry →- What peak temperature and dwell time must the label withstand?
- Which cleaning chemicals or washes does the board go through?
- What is the board surface (solder mask, bare, conformal-coated)?
- What code type and data format do you need (2D, barcode, serial range)?
- How much space is available for the label, and how precisely is it placed?
- Do you need ESD-safe or cleanroom-compatible materials?
HOW WE WORK ON YOUR PROGRAM
From first drawing to repeat supply.
- 1
Review the process profile
Peak soldering temperature, dwell time, cleaning chemistry and handling.
- 2
Select the construction
Face material, adhesive and print system matched to the board and process.
- 3
Prototype and read-test
Samples with printed codes, scanned and verified on your equipment.
- 4
Pilot on the line
Fit, adhesion and readability checked through reflow and cleaning.
- 5
Scale with revision control
Approved artwork and data format locked for repeat supply.
QUESTIONS
Electronics, EMS & Semiconductor: common questions.
Will your labels survive reflow soldering and board cleaning?
PCB and polyimide label constructions are chosen against your peak temperature, dwell time and cleaning chemistry. Share your process profile and we match the label and adhesive before samples are made.
Can labels carry 2D codes for board-level traceability?
Yes. Serial numbers, barcodes and 2D codes are printed to your data format, and readability is verified so the code scans at every stage of the line.
Which materials do you cut for heat management in compact assemblies?
Thermal gap fillers and interface materials, die-cut to the shape of the component or heat path on your drawing.
What do you offer for electrical separation inside modules?
FR4, Nomex®, Formex® and polyester films, cut and laminated to your drawing for barriers, insulators and spacers.
How do you confirm very small labels will work on our board?
We review the available space, surface finish and placement tolerance on your drawing, then confirm feasibility with samples before production.
EXPLORE MORE
Other industries we serve.
QUALITY & APPROVALS
Built to recognised quality systems.
Nextep works to recognised quality systems across industrial, automotive and aerospace programs. Ask us to confirm the scope that applies to your part.
NEXT STEP
Let’s frame the right specification.
Share your substrate, environment and lifecycle requirement with our team.